| 标题 |
Two-in-one demonstration of anisotropic thermal management and near-field EMI shielding via vertically aligned carbon fibers composites in electronic packaging |
| 网址 | |
| DOI | |
| 其它 |
期刊:Composites Part B-engineering 作者:Shulin Lei; Dingkun Tian; Jingke Wang; Jiangdong Cui; Ziyu Duan; et al 出版日期:2026-01-14 |
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(2025-6-4)