| 标题 |
Multi-scale interfacial engineering of hierarchical sandwich-structured conductive polymer composites for flexible electronics |
| 网址 | |
| DOI | |
| 其它 |
期刊:Composites Science and Technology 作者:Ling Wang; Yuntao Liu; Peizhao Luo; Zhefan Li; Hao Wang; et al 出版日期:2026 |
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(2025-6-4)