| 标题 |
Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Advanced Joining Processes 作者:Jianing Wang; Jieshi Chen; Lixia Zhang; Zhiyuan Zhang; Yuzhu Han; et al 出版日期:2022-07-01 |
| 求助人 | |
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(2025-6-4)