| 标题 |
 3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications |
| 网址 | |
| DOI |
10.1115/ipack2015-48584
doi
|
| 其它 |
期刊：Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays 作者：Xuchen Zhang; Xuefei Han; Thomas E. Sarvey; Craig E. Green; Peter A. Kottke; et al 出版日期：2015-07-06 |
| 求助人 | |
| 下载 | 该求助完结已超 24 小时，文件已从服务器自动删除，无法下载。 |
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