| 标题 |
Methodology on thermal prediction of high-power memory modules considering air velocity, chip size and power consumption |
| 网址 | |
| DOI | |
| 其它 |
期刊:13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 作者: Je-Hyoung Park; Jae-Sang Baik; Jin-Kyu Chang; Seung-Jin Seo 出版日期:2012 |
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(2025-6-4)