| 标题 |
Surface treatment of copper for the adhesion improvement to epoxy mold compounds |
| 网址 | |
| DOI | |
| 其它 |
期刊:1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) 作者:C.Q. Cui; H.L. Tay; T.C. Chai; R. Ggopalakrishan; T.B. Lim 出版日期:2002-11-27 |
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