| 标题 |
Sucrose-Assisted Interface Engineering of Boron Nitride for BT-Based High-Frequency Electronic Packaging Substrates with Low Dielectric Loss and Enhanced Thermal Conductivity |
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| DOI | |
| 其它 |
期刊:ACS Applied Materials and Interfaces 作者:Hao Wang; Yu-Xin He; Kang Luo; En-Zhu Li; Bin Tang; et al 出版日期:2026-08-31 |
| 求助人 | |
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(2025-6-4)