| 标题 |
High performance IPDs (Integrated passive devices) and TGV (Through glass via) interposer technology using the photosensitive glass |
| 网址 | |
| DOI | |
| 其它 |
期刊:2014 IEEE 64th Electronic Components and Technology Conference (ECTC) 作者:Jong-Min Yook; Dongsu Kim; Jun Chul Kim 出版日期:2014-05-01 |
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(2025-6-4)