| 标题 |
Electromigration Behavior of Cu/SiCN to Cu/SiCN Hybrid Bonds for 3D Integrated Circuits |
| 网址 | |
| DOI |
10.7567/ssdm.2018.g-1-04
doi
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| 其它 |
期刊:Extended Abstracts of the 2018 International Conference on Solid State Devices and Materials 作者:J.De Messemaeker; S.-W. Kim; M. Stucchi; G. Beyer; E. Beyne; et al 出版日期:2018-07-19 |
| 求助人 | |
| 下载 |
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(2025-6-4)