| 标题 |
Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronic Engineering 作者:Tanu Sharma; Ralf Brüning; Tang Cam Lai Nguyen; Tobias Bernhard; Frank Brüning 出版日期:2015-06-06 |
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(2025-6-4)