| 标题 |
Thermal Performance Optimization of the Three-Dimensional Integrated Circuits Employing the Integrated Chip-Size Double-Layer or Multi-Layer Microchannels |
| 网址 | |
| DOI | |
| 其它 |
期刊:ASME Journal of Heat and Mass Transfer 作者:Sainan Lu; Kambiz Vafai 出版日期:2022-08-16 |
| 求助人 | |
| 下载 |
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(2025-6-4)