Lv2
126 积分 2025-11-07 加入
Heat transfer enhancement of symmetric and parallel wavy microchannel heat sinks with secondary branch design
3天前
已完结
Suppressing plasma-induced particulate contamination in die-to-wafer hybrid bonding via the highly cross-linked and stable UV tape
5天前
待确认
Energy efficient hotspot-targeted embedded liquid cooling of electronics
17天前
已完结
Bionic fish gill structure: Design and optimization of embedded microchannels with TSV structure
20天前
已完结
Numerical simulation of flow and heat transfer characteristics of microchannels with ribbed structures of bionic fish fins
20天前
已完结
Multi-chip Jet impingement cooling for heat dissipation in 2.5D integrated system with 1 kW+ thermal design power
1个月前
已完结
Enhanced heat transfer and flow characteristics of a bionic fish scale microchannel heat exchanger made by powder bed fusion (PBF) additive manufacturing
2个月前
已完结
Recent Advances and Trends in Advanced Packaging
2个月前
已完结
Thermal Performance Optimization of the Three-Dimensional Integrated Circuits Employing the Integrated Chip-Size Double-Layer or Multi-Layer Microchannels
3个月前
已完结
Wafer-Level Integration of Liquid Cooling Microchannel on CMOS Chips with Cu-Cu Low-Temperature Bonding Process
3个月前
已完结
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