| 标题 |
Bonding Analyses in the Broad Realm of Intermetallics: Understanding the Role of Chemical Bonding in the Design of Novel Materials |
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| DOI | |
| 其它 |
期刊:Chemistry of Materials 作者:Linda S. Reitz; Jan Hempelmann; Peter C. Müller; Richard Dronskowski; Simon Steinberg 出版日期:2024-07-09 |
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(2025-6-4)