| 标题 |
Novel Process Integration for Highly Reliable and Manufacturable 0.4-μm-pitch 50 M Cu-Cu Connections |
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期刊:2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 作者:Yukako Ikegami; Ken Arano; Masanori Chiyozono; Kengo Kotoo; Kan Shimizu; et al 出版日期:2026-05-26 |
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(2025-6-4)