| 标题 |
Package Miniaturization and Wiring Impedance Reduction for High-bandwidth Memory Devices with Vertical Wire Bonding |
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| 其它 |
期刊:2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 作者:Keita Mochizuki; Hiroyuki Wakioka; Tsutomu Fujita; Masatoshi Shomura; Takeori Maeda; et al 出版日期:2024-06-27 |
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(2025-6-4)