| 标题 |
Highly dynamic tempered in-mold thermocompression bonding of microfluidic chips: process characteristics and bonding performances |
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| DOI | |
| 其它 |
期刊:Journal of Materials Research and Technology 作者:Baishun Zhao; Wangqing Wu; Mingyong Zhou; Bingyan Jiang; Gerhard Ziegmann 出版日期:2023-05-01 |
| 求助人 | |
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(2025-6-4)