退火(玻璃)
材料科学
铜
晶界
结晶度
电阻率和电导率
电导率
粒度
复合材料
电镀
透射电子显微镜
黄铜矿
冶金
纳米技术
微观结构
图层(电子)
物理化学
化学
工程类
电气工程
作者
Guodong Zhang,Junwei Yu,Chao Su,Chengrui Di,Shengzong Ci,Yuanming Mou,Yunguo Fu,Kun Qiao
标识
DOI:10.1016/j.surfin.2023.102630
摘要
In this paper, we prepared copper-coated carbon fibers (CFs) by electroplating and studied the effect of annealing temperature on the electrical conductivity and mechanical properties of these fibers. The results showed that the defects of the copper layer were reduced after annealing. The XRD peak intensity and grain size of the copper layer increased significantly with the increase in annealing temperature, indicating that annealing can effectively increase crystallinity and reduce the presence of grain boundaries. After annealing for 20 min, the conductivity of the copper-coated CFs increased by 78 times, and the mechanical properties also improved. The effect of grain boundaries on the electronic transport properties of copper was studied using the density functional tight-binding method in combination with the non-equilibrium Green's function method. According to the results, the existence of grain boundaries reduces the transmission probability of electrons and current passing through the system, as well as the uniformity of the atomic potential distribution in the central region of the structure, which hinders the transmission of electrons.
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