Revealing the controlling mechanisms of atomic layer etching for high-k dielectrics in conventional inductively coupled plasma etching tool

The possibilities of optimization of the two-step atomic layer etching process for HfO2 in conventional plasma etching tools were studied. The surface modification step was realized in Ar/CF4/H2 plasma, and the reaction between the modified layer and the surface was activated by Ar ion bombardment from the plasma in the second step. Investigation of the effects of activation step duration, DC bias during activation, and Ar plasma density was carried out. The mechanism of the etching process has been shown to involve fluorination of oxide during the modification step and subsequent removal of fluorine-containing particles at the activation step. An increase in parasitic sputtering rate and lower process saturation with the growth of DC bias during activation was demonstrated. The advantage of the ALE process in lower surface roughness over the conventional etching process was shown. Similar etching characteristics of HfO2 and ZrO2 suggest a similarity in the etching process for the mixed hafnium-zirconium oxide material.