节点(物理)
计算机科学
嵌入式系统
下降(电信)
工程类
电信
结构工程
作者
Jongmin Lee,Jae Jin Jeong,Sanghan Lee,Sanghan Lee,J. Lim,S. C. Song,S. Ekbote,Nick Stevens-Yu,D. Greenlaw,Rock‐Hyun Baek
标识
DOI:10.23919/vlsitechnologyandcir57934.2023.10185394
摘要
For the first time, we propose selection guidelines for using the front-side (FS) or back-side (BS) power delivery network (PDN) in a $2\mathrm{~nm}$ node. IR drop of various FS and BS-PDN structures have been analyzed for high-performance computing (HPC) and mobile SoC applications. Added process cost (PC) of BS-PDN should be $\lt 5.9\%$ of nanosheet FET (NSFET) based front-side cost for mobile SoCs, but much higher $\lt 10.9\%$ for HPCs, to be cost-effective at similar IR drop.
科研通智能强力驱动
Strongly Powered by AbleSci AI