The synergistic effect and origin of strength in carbon fiber reinforced PAEK, PEEK, and PEKK high‐performance thermoplastic composites manufactured by multi‐scale aqueous dispersion coating

材料科学 偷看 复合材料 复合数 体积分数 结晶度 抗弯强度 热塑性塑料 聚醚醚酮 聚合物
作者
V. Balakumaran,R. Alagirusamy,Dinesh Kalyanasundaram
出处
期刊:Polymer Composites [Wiley]
被引量:5
标识
DOI:10.1002/pc.28682
摘要

Abstract High‐performance thermoplastic composites of polyketones [poly‐aryl‐ether‐ketone (PAEK), poly‐ether‐ether‐ketone (PEEK), poly‐ether‐ketone‐ketone (PEKK)] reinforced with continuous carbon fiber (CF) were consolidated using towpreg produced by multi‐scale aqueous dispersion coating technique. An intra‐matrix trend of composite strength and void fraction was studied to identify the composite with maximum strength free of voids for each polyketone matrix. The CF/PAEK composite with a flexural strength of ~2047 MPa and ILSS of ~99 MPa with a fiber volume fraction of ~67% had the maximum strength free of voids among CF/PAEK composite and all polyketone composites studied. The highest crystallinity (34.5%), and the highest amount of hydrogen bonding and bonds formed between CF, PI nanoparticle, and PAEK explained the origin of strength in CF/PAEK composite. The maximum strength among CF/PEEK and CF/PEKK composite free of voids had a flexural strength of ~1861 MPa, ~1981 MPa; ILSS of ~74 MPa, ~60 MPa; fiber volume fraction of ~61% and ~ 65%, respectively. The polyimide (PI) nanoparticles layer on CF formed the fiber matrix interface, supported hydrogen bonding in all polyketone composites, and formed bonds with CF and matrices of PAEK and PEEK establishing a synergistic effect. Highlights Intra‐matrix trend of strength and voids in polyketone composites studied. Void‐free, high‐performance, high fiber volume fraction composites developed. CF/PAEK composite had maximum strength among polyketone composites studied. PI nanoparticles formed bonds with CF and matrices of PAEK and PEEK. CF/PAEK composite strength originates from crystallinity, H bond, and bonding.
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