Shear failure evolution and its dispersion of plain woven ceramic matrix composites z‐pin structure

Abstract In this paper, the digital image correlation technique was applied to the shear test of 2D SiC/SiC composites z‐pin with the purpose of analyzing the shear behavior of the plain woven pin and studying the structure factors of test results dispersion. After obtaining the strain–stress curves of the joint's connection region, the evolution of z‐pin shear failure process was investigated. The z‐pin's failure fractures were observed, and the main factors of its dispersion of shear mechanical properties were discussed. Changing the yarn parameter of model building and importing into Workbench for calculation, the average stress results in the shear plane were obtained. Different simulation results show that optimization of plain‐woven pin structure parameters can effectively improve its shear strength.