Abstract Mechanoluminescence (ML) materials with their unique stress‐to‐light conversion capability, have been driving the evolution of stress sensing technology from single‐point detection to multi‐dimensional imaging. Recent advances in material defect engineering, ion doping, and heterostructure design have significantly improved the luminosity, response kinetics, and environmental stability of ML materials. These enhancements have established a technical foundation for multimodal stress visualization across diverse application scenarios. To systematically analyse the stress response mechanism and visual behavior of materials across different spatial dimensions, this review offers in‐depth discussions on material design principles, device integration methods, and application scenarios for 0D, 1D, 2D, and 3D stress sensing technologies. It further proposes targeted solutions to common challenges in multi‐dimensional stress sensing, such as material performance, device integration synergy, and data processing. Finally, the development path of multi‐dimensional stress visualization technology will be looked forward with higher spatial resolution in intelligent diagnosis, biomechanics, and extreme environmental monitoring, providing a theoretical framework and technical support for multi‐dimensional stress visualization detection.