Toward High‐Thermal‐Conductivity Polymer‐Based Materials: Breakthroughs and Barriers

ABSTRACT Polymers are highly valued for their lightweight, corrosion‐resistant nature and ease of processing, making them essential across various industries. However, their inherently disordered molecular structures result in low thermal conductivity, generally below 0.5 W/mK, which restricts their use in advanced, high‐frequency, and high‐power electronic components. Consequently, enhancing the thermal conductivity of polymers is a priority for both scientific research and practical applications. Considerable progress has been achieved through two principal strategies: developing pure polymers with high thermal conductivity and engineering polymer composites by incorporating thermally conductive fillers. This paper reviews recent breakthroughs in both areas, systematically analyzing various material designs and associated heat transfer mechanisms, while highlighting synergistic improvements in both thermal conductivity and other functional properties. The review concludes with a discussion of potential applications for thermally conductive materials, as well as the challenges and opportunities in creating next‐generation polymer‐based materials with superior heat‐dissipation performance.