The Development of a Non-Conductive Die Attach Film for High-Reliability Applications

Market demands and packaging trends are driving the continued miniaturization, and high functionality requirements for semiconductor devices. To make these new designs feasible in application, packaging materials are expected to deliver high adhesion strength and better reliability. For certain sectors, such as automotive, extremely high reliability is a prerequisite to meet the market's strict safety guidelines and performance objectives. Die attach film adhesives are used to bond active die to metal leadframe or laminate substrates. To achieve high adhesion, formulation protocols use a polymer matrix with epoxy hybrid chemistry and proprietary curing agents. Especially for automotive packages, die attach adhesives must pass harsh moisture resistivity testing (MRT), and endure extended temperature cycling for a wide application temperature range (from –65 °C to 150 °C). Resin systems play a critical role in electrically non-conductive, high adhesion die attach film adhesive applications. These applications also require materials that can provide tight bondline thickness control, and good adhesion to pass all reliability tests for high UPH manufacturing.This paper discusses the development of a new non- conductive die attach film material, with an analysis of its properties and application testing results. The die attach adhesive uses a novel epoxy hybrid resin platform for film applications. Results demonstrate that the material exhibits robust processing capability and a wide process window for die attach applications. Its adhesion performance on multiple leadframe and laminate substrates was analyzed within high reliability automotive applications that require high adhesion strength properties.