异质结双极晶体管
放大器
材料科学
功率(物理)
补偿(心理学)
可靠性(半导体)
电流源
热稳定性
电流(流体)
热的
光电子学
电子工程
晶体管
电气工程
双极结晶体管
电压
工程类
物理
热力学
心理学
CMOS芯片
化学工程
精神分析
作者
Yuanbo Ma,Zhaohui Wu,Bin Li
出处
期刊:Electronics
[Multidisciplinary Digital Publishing Institute]
日期:2022-06-26
卷期号:11 (13): 2000-2000
被引量:1
标识
DOI:10.3390/electronics11132000
摘要
In this paper, the thermal stability of GaAs heterojunction bipolar transistor (HBT) power amplifier (PA) in a sub-6G band has been improved by a multi-source co-simulation method. To reduce the parameter errors caused by the variations of thermal resistances, a co-simulation method for the multiple heat sources of fully-integrated PA is proposed. Specifically, an adjustable bias circuit is applied on the PA for temperature compensation using a zero-to-absolute-temperature (ZTAT) current. To verify the proposed method, a sub-6G PA is realized in the GaAs HBT process. The experimental results show that the variations in power added efficiency and output power is stabilized due to the 3.5% error ZTAT current. The errors between simulation and measurement are reduced from 6% to 1%. According to the thermal factor defined in co-simulation, the working temperature decreases 10 °C, while the area only increases 27%. The above results prove that that thermal stability and the simulation reliability can be co-designed with the minimal area cost.
科研通智能强力驱动
Strongly Powered by AbleSci AI