抵抗
极端紫外线
极紫外光刻
材料科学
散粒噪声
GSM演进的增强数据速率
波长
光学
临界尺寸
随机性
极值理论
噪音(视频)
聚合物
表面光洁度
纳米技术
光电子学
图像(数学)
复合材料
计算机科学
物理
统计
数学
激光器
计算机视觉
探测器
图层(电子)
作者
Makoto Muramatsu,Arisa Hara,Satoru Shimura,Hidetami Yaegashi
标识
DOI:10.2494/photopolymer.34.55
摘要
Extreme ultraviolet (EUV) with a wavelength of 13.5 nm has already been mass-produced, but serious technical problems remain an important issue. One of them is the line edge roughness (LER) value for critical dimension (CD). Local variations such as intra-filed CD uniformity and LER are usually identified from the average CD calculated using top-down view observations. However, it is not possible to get an overall picture of LER. In this study, cross-section SEM was applied efficiently to visualize or quantify the basic behavior of the resist. In addition, the resolution limits and minimum structural units that make up the resist pattern associated with LER are discussed.
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