MOSFET
碳化硅
材料科学
短路
沟槽
光电子学
碳化物
电气工程
晶体管
复合材料
工程类
电压
图层(电子)
作者
Masakazu Okada,Shinya Kyogoku,Teruaki Kumazawa,Jun Saito,Tadao Morimoto,Manabu Takei,Shinsuke Harada
标识
DOI:10.1109/ispsd46842.2020.9170126
摘要
This study demonstrated the short-circuit performance of 1.2 kV-class silicon carbide (SiC) trench-gate superjunction MOSFET (SJ-UMOSFET) through experiments and numerical simulation. The SJ structure showed a substantially improved trade-off between specific on-resistance and short-circuit capability when compared with a conventional UMOSFET, especially at a high temperature (175°C), owing to the low temperature coefficient of the specific on-resistance. Furthermore, the electro-thermal simulation showed that the SJ-UMOSFET exhibited a larger distance from an internal hot spot to the source metal contact than the UMOSFET; this increase in distance contributed to the improved short-circuit capability demonstrated in the experiment.
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