Construction of bi-continuous structure in fPC/ABS-hBN(GB) composites with simultaneous enhanced thermal conductivity and mechanical properties

With the continuous development of modern electronic equipment, thermal management of electronic devices has become the focus of attention due to the energy consumption. As an important part of thermal management system, it is necessary to develop an electrical equipment shell with both superior thermal conductivity and mechanical properties for better thermal management performance. However, it is very difficult to balance the relationship between thermal conductivity and mechanical properties of thermal conductive polymer composites. Increasing filling content of thermal conductive fillers would lead to heavy damage of mechanical properties. In this paper, we construct a bi-continuous structure to solve this problem. The ABS phase provides thermal conductivity enhancement, while the PC phase is responsible for mechanical property maintaining. A highest thermal conductivity of 0.476 W/(m⋅K), 138% higher than that of pure PC, can be obtained after optimum design of formulation and processing conditions. Meanwhile, the mechanical properties of PC/ABS composite are also enhanced comparing with filled-PC. Moreover, the reported PC/ABS composite has excellent electrical insulation and dielectric properties. Overall, our PC/ABS composites with simultaneous enhanced thermal conductivity and mechanical properties are of great prospect as electrical equipment shells for efficient thermal dissipation.