Thermo-Mechanical and Viscoelastic Properties of an Underfill Material for RDL-First Process

Underfill material has been a significant component of microelectronic packaging for decades. It has been successfully used in the flip-chip (FC) process, and greatly improved the thermal and mechanical reliability of the chip packaging. In this paper, we developed a simple sample preparation method, characterized and analyzed the thermo-mechanical and viscoelastic properties of a commercial underfill used in the redistribution layer (RDL)-first packaging process. The experimental results could support the database buildup, which needed for the development of high accuracy modeling systems.