Effect of dry ice jet velocity on cooling characteristics of electronic chip based on optimized geometry

Efficient chip cooling has become particularly important with the rapid development of high heat flux electronic chips. In this study, a cooling system for electronic chips using dry ice as the cooling medium is developed. The combination of jet impingement and phase change sublimation was employed to achieve efficient cooling by utilizing the Joule-Thomson effect to generate dry ice. The impact of the ratio of heatsink height to inlet diameter (H/D) and dry ice jet velocity on the heat transfer characteristics of the heatsink is investigated by theoretical calculations and experimental tests. The results showed that the optimal heat transfer coefficient was achieved when H/D was 4, 12.76% to 43.28% higher than other H/D values. The chip temperature could be maintained below 38.69°C, which was 8.79% to 36.62% lower than other H/D values, and the heat flux reached 428.92W/cm2. The chip temperature could be effectively regulated by controlling the dry ice flow rate. Furthermore, a comparison with other cooling methods indicated that the dry ice jet cooling system was more suitable for cooling high heat flux electronic devices. The research findings laid the foundation for dry ice cooling of high heat flux chips.