上部结构
材料科学
微晶
空位缺陷
凝聚态物理
各向异性
刚度
弹性(物理)
电子结构
泊松比
弹性模量
模数
杨氏模量
泊松分布
热力学
复合材料
物理
数学
光学
冶金
统计
作者
Jiunn Chen,Yi‐Shao Lai,Chung-Yuan Ren,D. J. Huang
摘要
We report the elastic properties of Cu3Sn superstructure based on first-principles calculations. Polycrystalline Young’s modulus and Poisson’s ratio are deduced from the calculated elastic stiffness. The calculations of electronic structures with the principal strains along different directions unravel the electronic nature of anisotropic elasticity of Cu3Sn. Weak Sn–Cu bonding in Cu3Sn suggests that Sn atoms are the dominant diffusion species, revealing the mechanism of vacancy formation within the Cu3Sn superstructure.
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