Analysis and Research on Application Failure of Automotive Microchip (MCU)

With the development of automobiles toward intelligence, electrification and networking, automotive electronic is increasingly used in automotive systems, and the role of automotive semiconductors in the "three modernizations" of automobiles is becoming more and more important. Analyzing the failure characteristics of vehicle-mounted microchips and studying its failure mechanism is an important method to optimize product design and improve product reliability, and it is of great significance to promote the application of vehicle-mounted microchips.In this paper, based on an on-board microchip (MCU for headlight control), from the application background, data analysis, through IV-curve, decap, microscopic observation, cross, it was found that the microchip fails due to 19-pin EOS; Through high current and high voltage simulation and IV curve analysis, it was found that the 22-pin is damaged by high current and high voltage on PCBA, but not 19-pin. Through the electrostatic tolerance experiment of each pin, circuit diagram analysis and electrostatic simulation, it was found that the antistatic ability of 19-pin is weaker than 14-pin and 22-pin, and the substrate layer microscopic characterization of 19-pin after electrostatic damage is similar to that of the failed parts. Finally, some suggestions for improvement are discussed.