Novel Etch Solution with SYM3® for Logic Beol Patterning Etch Applications

With technology node shrinks in logic / foundry, patterning etch and Titanium Nitride (TiN) Hard Mask Open (HMO) are facing increasing challenges on on-wafer performance and productivity control to ensure device performance and yield. Applied Materials' etch product Sym3® is developed to address such challenges with unique chamber design and innovative features via uniformity tuning, etch profile and selectivity control, process window expansion, and defectivity control. Till date >10000 chambers have been deployed in logic and memories fabs and are production-proven as leading solution for patterning and TiN HMO etch.