散热片
热阻
材料科学
传热
鳍
压力降
电子设备冷却
热的
计算机冷却
复合材料
碳化硅
水冷
金属泡沫
计算流体力学
机械工程
结构工程
铝
机械
工程类
电子设备和系统的热管理
热力学
物理
作者
K.A. Moores,Yogendra Joshi,G. H. Schiroky
出处
期刊:IEEE Transactions on Components and Packaging Technologies
[Institute of Electrical and Electronics Engineers]
日期:2001-06-01
卷期号:24 (2): 213-219
被引量:22
摘要
In this study, we present the thermal analysis and experimental performance assessment of an aluminum silicon carbide (AlSiC) metal matrix composite (MMC) base plate with integral cooling fins. By attaching a pin-finned base plate to an open-chambered flow-through heat sink, the mechanical interface between the base plate and cooling medium is eliminated. This reduces the overall thermal resistance and improves module reliability as compared with traditional base plate cooling schemes. Computational fluid dynamics and heat transfer techniques were employed to model the thermal and hydrodynamic resistance characteristics through the pin fin structure of a prototype base plate design. A unit-cell approach was employed to avoid the computational expense of modeling the entire pin array. Performance was verified experimentally in a closed loop test facility using water as the cooling fluid. It was found that the unit-cell approach produced good agreement with experimental pressure drop and heat transfer results.
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