In this paper, aiming at the characteristics of exposure parameters during thick photoresist lithography, we present an enhanced Dill exposure model suitable for describing the thick photoresist exposure. And the statistical theroy trend surface analysis is introduced so that the regularity of the exposure parameters varying with the thickness of the thick photoresist and technique conditions can be discovered. At last, the trend analysis of exposure parameters with the thickness of the photoresist AZ4562 is given, which provides an important basis for the experiment or simulation research of the thick photoresist lithography.