Specific ion effects on copper electroplating

The main goal of this work is to open new perspectives in the field of electrodeposition and provide green alternatives to the electroplating industry. The effect of different anions (SO₄^2-, ClO₃^-, NO₃^-, ClO₄^-, BF₄^-, PF₆^-) in solution on the electrodeposition of copper was investigated. The solutions, containing only the copper precursor and the background electrolyte, were tailored to minimize the environmental impact and reduce the use of organic additives and surfactants. The study is based on electrochemical measurements carried out to verify that no metal complexation takes place. We assessed the nucleation and growth mechanism, we performed a morphological characterization through scanning electron microscopy and deposition efficiency by measuring the film thickness through X-ray fluorescence spectroscopy. Significant differences in the growth mechanism and in the morphology of the electrodeposited films, were observed as a function of the background electrolyte.