Polymer/mold interfacial heat transfer during injection molding

材料科学 热流密度 模具 复合材料 传热 热电偶 热传导 造型(装饰) 传热系数 转移模塑 热力学 物理
作者
D. Kamala Nathan,K. Narayan Prabhu
出处
期刊:Polymer Engineering and Science [Wiley]
卷期号:64 (2): 888-900
标识
DOI:10.1002/pen.26592
摘要

Abstract An experimental injection molding setup was designed and fabricated. The purpose of the setup is to cast polymer components and estimate the polymer/mold interfacial heat flux transients during injection molding. The mold plate is instrumented with K‐type thermocouples to record its thermal history continuously during the cyclic process. Experiments were performed at a melt injection temperature of 280°C. Velocity and shear rate profiles were determined to assess the flow behavior of the melt. The spatiotemporal heat flux transients at the interface and the mold surface temperature were estimated using measured temperature data inside the mold as input to an inverse heat conduction problem. The estimated boundary heat flux transients were used to numerically simulate the polymer melt's cooling behavior. From the estimated heat flux and surface temperatures, heat transfer coefficients (HTC) were determined. The peak value of the HTC was 5775 W/m 2 K and occurred at a mold surface temperature of 35.7°C and polymer surface temperature of 47.4°C. The evolution of the air gap at the interface was quantified using an exponential fit. The estimated air gap width corresponding to peak HTC was about 4 μm and increased to about 100 μm towards the end of the solidification. While the peak heat flux is associated with the start of the formation of polymer skin on the mold surface, the peak HTC corresponds to the onset of nucleation of the air gap or a nonconforming contact. Highlights An experimental setup to study heat transfer during injection molding. Spatiotemporal heat flux transients (q) were estimated during injection molding. Polymer temperatures were simulated using q, and HTC was determined. The peak HTC indicated the onset of nucleation of an air gap. Evolution of air gap at the interface was modeled using an exponential fit.

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