示意图
电磁屏蔽
材料科学
复合材料
复合数
消散
阻抗匹配
电磁干扰
电阻抗
相(物质)
热的
电子设备和系统的热管理
干扰(通信)
机械工程
电子工程
电气工程
工程类
物理
频道(广播)
气象学
热力学
量子力学
作者
Jie He,Jiaozu Wu,Chul B. Park,Pengjian Gong,Chaobo Liang,Guangxian Li
出处
期刊:Nanoscale
[Royal Society of Chemistry]
日期:2024-01-01
卷期号:16 (35): 16622-16631
被引量:8
摘要
) of 0.04. In CST simulations, the intrinsic mechanism of electromagnetic energy loss within the material is revealed by energy loss density cloud maps. In addition, heat from high-temperature objects is transferred through the highly thermally conductive AgNW-PI membrane to the long-channel Ni@C/r-GO backbone. Therefore, the composites prepared on the basis of impedance matching will accelerate the use of EMI shielding materials for the thermal management of portable electronic devices and battery heat dissipation packaging.
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