Microlens lithography and smart masks

We report on recent progress in the implementation of microlens lithography. In addition, we will introduce a new lithographic method, smart mask lithography. Microlens lithography is aimed at the fabrication of flat panel displays (FPD), multichip modules (MCM) and micromachining. An array of micro-objectives is used to image a photomask onto a resist layer. Microlens lithography provides a resolution of 3 to 5 μm, a depth of focus of 50 to 100 μm, and a working distance of 1 to 3 mm. Smart mask lithography is aimed at the printing of simple mask patterns, such as a matrix of posts or holes, as required for field emission displays (FEDs), or other patterns consisting of dots, lines, circles, or rectangles, as required for MCMs and printed circuit boards). Smart mask lithography covers the range of 1 to 100 μm feature sizes. We will present experimental results and discuss advantage and problems of both methods.