Study of the Behavior of the Functional Group on the Direct Copper Sputtered Interface using Vacuum Ultraviolet Light

Sputtering method is used to form the seed layer for copper electric plating. In general, copper sputter has weak adhesion to resin, so titanium sputter is combined to increase the adhesion strength. However, etching in the lithography process requires two types of processes, titanium and copper metal. Adhesion strength was improved by performing vacuum ultraviolet treatment as a pretreatment for medium-vacuum sputtering. We discovered the relationship between the hydroxyl groups on the resin surface and the adhesion force by the chemical modification XPS method. Furthermore, by XPS analysis of the peeled copper interface, the adhesion mechanism between the resin and copper due to vacuum ultraviolet light irradiation was estimated. We evaluated the absorption properties in the vacuum ultraviolet region of a thinly polished glass epoxy resin. We investigated the behavior of functional groups at the interface and considered the effect of vacuum ultraviolet light in the depth direction.