193 nm laser annealing on p-GaN with enhanced hole concentration and wall-plug-efficiency in deep ultraviolet LED

The high acceptor ionization energy and, thus, low carrier concentration in p-type III-nitride have widely been recognized as the bottleneck preventing the development of high-efficiency light-emitting-diodes (LEDs). In this contribution, the influences of 193 nm pulsed laser annealing on the structure, electrical, and optical properties of p-type GaN were systematically analyzed. The hole concentration of p-GaN first increases and then decreases with increasing laser fluence, regardless of post-growth thermal annealing. The effective dopant activation due to laser annealing can be attributed to the dissociation of Mg–H complexes during the treatment. Laser-annealed p-GaN was utilized in a 280 nm deep ultraviolet LED. A maximum of 1.47 times higher wall-plug-efficiency enhancement factor was obtained compared to that without laser annealing, demonstrating that 193 nm laser annealing plays a decisive role in the boosting of quantum efficiency of optoelectronic devices.