材料科学
薄膜
光电子学
工程物理
纳米技术
物理
作者
X. G. Fan,Bian Tian,Meng Shi,Zhongkai Zhang,Zhaojun Liu,Guoliang Zhou,Jiangjiang Liu,Le Li,Qijing Lin,Zhuangde Jiang
标识
DOI:10.1088/2631-7990/ad5941
摘要
Abstract High-temperature thin-film thermocouples (TFTCs) have attracted significant attention in the aerospace and steel metallurgy industry. However, previous studies on TFTCs have primarily focused on the two-dimensional planar-type, whose thermal sensitive area has to be perpendicular to the test environment, and therefore affects the thermal fluids pattern or loses accuracy. In order to address this problem, recent studies have developed three-dimensional probe-type TFTCs, which can be set parallel to the test environment. Nevertheless, the probe-type TFTCs are limited by their measurement threshold and poor stability at high temperatures. To address these issues, in this study, we propose a novel probe-type TFTC with a sandwich structure. The sensitive layer is compounded with indium oxide doped zinc oxide and fabricated using screen-printing technology. With the protection of sandwich structure on electrode film, the sensor demonstrates robust high-temperature stability, enabling continuous working at 1200 °C above 5 h with a low drift rate of 2.3 °C·h −1 . This sensor exhibits a high repeatability of 99.3% when measuring a wide range of temperatures, which is beyond the most existing probe-type TFTCs reported in the literature. With its excellent high-temperature performance, this temperature sensor holds immense potentials for enhancing equipment safety in the aerospace engineering and ensuring product quality in the steel metallurgy industry.
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