Optimal design of a microchannel heat sink with a pin-fin array integrated with Si interposer

Due to the technology advantages (short interconnect path, small signal delay, large data transmission bandwidth, low heat transport thermal resistance and small packaging volume), through silicon via (TSV) packaging developed rapidly. Accompanying with the application of the 3D packaging the heat dissipation is urgent. In order to improve the thermal performance of the packaging system, the microchannel heat sink with a pin-fin array integrated with Si interposer is designed and optimized with finite element method. The TSVs was designed at the surrounding of the heat sink to guarantee the electrical reliability of the Si interposer. The locations of the inlet and outlet of the heat sink was analyzed to optimize the heat dissipation capability of the heat sink integrated with the Si interposer.