材料科学
热导率
层状结构
复合材料
石墨烯
复合数
石蜡
热流密度
传热
热阻
热的
蜡
散热膏
消散
热能储存
热容
热传导
强化传热
电子设备和系统的热管理
作者
Xiaoqian Teng,Chuanren Ye,Shantao Zhang,Yanwu Zhu
出处
期刊:ACS Nano
[American Chemical Society]
日期:2026-01-08
卷期号:20 (2): 2239-2247
被引量:6
标识
DOI:10.1021/acsnano.5c17391
摘要
High-performance thermal interface materials (TIMs) often encounter the trade-off between high thermal conductivity and superior compliance. Herein, we report a graphene-based lamellar composite consisting of vertical graphene films and modified paraffin wax, fabricated by a layer-by-layer rolling assembly. Owing to the excellent deformability and confined flow of melted paraffin wax between graphene films, the composite shows a low contact thermal resistance of 17 K mm2 W–1 at 60 psi as a heat transfer interface, without leakage of paraffin wax. Due to the synergistic effect between the high heat capacity of paraffin wax and the high thermal conductivity of graphene films, the composite TIM yields an ultrahigh overall thermal conductivity of 789 W m–1 K–1 at 55 °C. When tested under a heat flux density of 30 W cm–2 on a simulated chip, the lamellar composite demonstrates a temperature rise much lower than that of a commercial TIM pad. The superior cooling efficiency indicates that the lamellar composite potentially offers a scalable and finely controllable design protocol for advanced TIMs to meet high-power heat dissipation requirements.
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