居里温度
材料科学
铁电性
大气温度范围
正交晶系
退火(玻璃)
脉冲激光沉积
兴奋剂
凝聚态物理
衍射
薄膜
分析化学(期刊)
复合材料
电介质
光学
纳米技术
铁磁性
光电子学
化学
物理
色谱法
气象学
作者
Takanori Mimura,Takao Shimizu,Yoshio Katsuya,Osami Sakata,Hiroshi Funakubo
标识
DOI:10.35848/1347-4065/ab6d84
摘要
The thickness- and orientation- dependences of Curie temperature were investigated for (111)-oriented, (100)-oriented and randomly-oriented 0.07YO1.5-0.93HfO2 films using high-temperature X-ray diffraction to study temperature stability of ferroelectric HfO2 based films. These (111)-, (100)- and randomly-oriented films with various film thickness were prepared at room temperature on (111)YSZ, (100)YSZ and Pt/TiOx/SiO2/Si substrates by pulsed laser deposition, respectively, and subsequent 1000 °C annealing to obtain ferroelectric orthorhombic phase. Although (111)-oriented films show that Curie temperature decreases with the decrease in thickness, the temperature was higher than 350 °C in 4.6–110 nm thickness range. (100)-oriented films show no thickness dependence of Curie temperature of 550 °C in 15–86 nm thickness range. Moreover, the Curie temperature of 10 nm thick randomly-oriented films was also 550 °C. These results revealed that the Curie temperature was above 350 °C, which is significantly high for the stable operation of memory application, regardless of the thickness and orientation.
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