Preparation of anisotropic polyimide aerogels for thermal protection with outstanding flexible resilience using the freeze-drying method

Polyimide aerogels (PIAs) not only possess excellent thermodynamic properties but also have a high porosity structure, making them an exceptional protective and thermal insulation material, and further broadening their application scope in aerospace and other cutting-edge fields. In this work, a series of anisotropic polyimide aerogels (3,3',4,4'-biphenyltetracarboxylic dianhydride (S-BPDA), p-phenylenediamine (PDA), 4,4'-diaminodiphenyl ether (ODA)) with excellent properties were prepared. These PIAs were obtained by unidirectional freeze-drying and thermal amination of two different precursor solutions mixed in proportion. These PIAs possess an irregularly oval tubular structure, exhibiting pronounced anisotropy. (PIA-2 exhibits outstanding flexible resilience in the radial direction. It can still regain its original form after half an hour of compression by a universal testing machine, yet it cannot do so in the axial direction. The thermal diffusivity of PIA-5 in the radial direction at room temperature is as low as 0.067 mm² s^-1, and even at 200 °C, the thermal diffusivity is as low as 0.057 mm² s^-1. Meanwhile, the thermal diffusivity in the axial direction at room temperature is 0.11 mm² s^-1, surpassing the value of 0.106 mm² s^-1 of aerogels prepared from monomeric raw materials and dried under supercritical conditions). PIAs exhibit outstanding thermal stability (the axial strength and modulus retention of PIA-8 at 200 °C are as high as 52.63% and 44.82%), and its weight loss temperature of 5% is as high as 603 °C and it has a glass softening temperature of 387 °C. PIAs also demonstrate exceptional flame retardancy in imitation flame retardant experiments and exhibit outstanding thermal insulation performance when heated on a 150 °C heating plate for 10 minutes (the radial surface temperature of PIA-5 was only 49.9 °C). These anisotropic PIAs materials exhibit outstanding flexible resilience, and thermal protection performance, holding significant importance for their widespread adoption as thermal insulation materials in aerospace, high-precision electronic components, and other domains.