烧结
材料科学
无压烧结
纳米银
基质(水族馆)
银纳米粒子
电子包装
冶金
数码产品
复合材料
纳米-
纳米技术
纳米颗粒
电气工程
工程类
海洋学
地质学
作者
Lilan Gao,Xinwei Tian,Chensi Wu,Yulong Xing,Yansong Tan,Xu Chen,Gongxuan Lü
标识
DOI:10.1109/icma54519.2022.9856054
摘要
Power electronics may operate at high temperatures even above 200∘C. In recent years, silver sintering technology is being gradually applied in high-temperature power electronic packaging due to its excellent thermal, electrical, and mechanical properties. Compared with early pressure-assisted silver sintering technology, silver pressureless sintering technology can simplify the sintering process and reduce capital investment. Silver sintering technology in chip-level and substrate-level packaging is presented as follows: firstly, the traditional and the state-of-the-art chip-level silver pressureless sintering technologies are reviewed: Secondly, the large-area substrate-level silver pressureless sintering technology is introduced, optimized and verified by experiments. Finally, the challenges and future outlook of silver pressureless sintering technology are summarized.
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