材料科学
原子层沉积
降级(电信)
热电效应
图层(电子)
沉积(地质)
热电发电机
纳米技术
光电子学
化学工程
工程物理
电子工程
热力学
古生物学
物理
沉积物
生物
工程类
作者
Pingjun Ying,Ruben Bueno Villoro,Amin Bahrami,Lennart Wilkens,Heiko Reith,Dominique Alexander Mattlat,V. Pacheco,Christina Scheu,Siyuan Zhang,Kornelius Nielsch,Ran He
标识
DOI:10.1002/adfm.202406473
摘要
Abstract Thermoelectric technology has witnessed a resurgence in recent years due to increasing demands for sustainable energy sources and efficient cooling systems. Recently, the introduction of Te‐free thermoelectric modules using non‐toxic, abundant materials including p ‐type MgAgSb and n ‐type Mg 3 (Sb,Bi) 2 marked a significant breakthrough. Despite promising performance, questions persist regarding long‐term robustness and stability, especially in harsh environments. In this study, a thorough exploration of thermoelectric modules is conducted, focusing on their performance degradation under various conditions. Through elemental mapping analysis, degradation mechanisms are identified within the modules during cycling in argon environments, where atomic migrations and the formation of complex oxides at contact regions are key factors. Furthermore, cycling tests in air reveal significant degradation, prompting the exploration of protective strategies. Surface coatings using atomic layer deposition (ALD) emerge as a promising solution, particularly by HfO 2 , demonstrating superior protective effects. Furthermore, re‐soldering effectively restores module performance is found, highlighting the importance of developing advanced soldering techniques to promote magnesium‐based thermoelectric technology as a sustainable alternative to Bi 2 Te 3 . These findings emphasize the importance of exploring novel contact materials and demonstrate the potential of ALD as a universal approach to enhancing module reliability and robustness.
科研通智能强力驱动
Strongly Powered by AbleSci AI