Recent Advances in Diamond-Abrasive Machining of Hard and Brittle Materials (Review)

This article examines state-of-the-art research on diamond-abrasive machining of hard and brittle materials, with a focus on reproducing machining conditions at microscopic scales using high-resolution instruments. The discussion emphasizes the increasing utilization of porous, rough-surfaced, and nanotwinned (nt-D) diamonds. A new type of diamond with a rough surface, synthesized via thermochemical corrosion, exhibits a larger surface area and greater electronegativity than conventional diamond. These characteristics enhance interfacial adhesion between the binder and the diamond. Molecular dynamics simulations demonstrate their effectiveness in analyzing the mechanisms of abrasive processes such as nanocutting, grinding, and polishing. The findings identify critical grinding depth, vibration amplitude, and cutting speed as key machining parameters that determine the transition of diamond-abrasive machining of hard and brittle materials into a plastic regime. Recent publications recognize chemical–mechanical polishing as an efficient method for processing materials such as silicon carbide, monocrystalline silicon, nanotwinned diamond, and boron-doped diamonds [1].