材料科学
倍半硅氧烷
聚酰亚胺
热重分析
纳米复合材料
热稳定性
二胺
差示扫描量热法
电介质
高分子化学
玻璃化转变
缩聚物
化学工程
乙醚
极限氧指数
聚合物
烧焦
复合材料
有机化学
热解
化学
光电子学
图层(电子)
工程类
物理
热力学
作者
S. Devaraju,M. R. Vengatesan,M. Selvi,A. Ashok Kumar,M. Alagar
标识
DOI:10.1177/0954008311433606
摘要
Polyhedral oligomeric silsesquioxane (POSS) – polyimide (PI) hybrid nanocomposites were prepared by a two-step approach, bisphenol-A ether diamine (BAED) and pyromelletic dianhydride (PMDA) in 1-methyl-2-pyrrolidone (NMP) were used to prepare polyamic acid (PAA) to which varying weight percentages of OAPS in NMP were added. During the second step, the polycondensation was effected by thermal imidization. The formation of hybrid nanocomposites was confirmed by using FTIR spectra. The thermal properties of POSS-PI nanocomposites were studied using differential scanning calorimetry and thermogravimetric analysis. The lowest dielectric constant 2.68 was achieved for 15 wt.% POSS-PI material when compared with the value of 3.34 for the neat PI. Data from thermal studies indicate that the incorporation of POSS into polyimide significantly enhanced the glass transition temperature ( T g ), thermal stability, char yield and flame-retardant properties of hybrid nanocomposites than that of neat PI. The excellent combination of both dielectric and thermal properties of the material developed in the present study will find application in microelectronics.
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